X-40-9225 is a silicone oligomer product, and is a low molecular weight product with the same molecular structure as a silicone resin. It contains alkoxysilyl groups, which allows it to modify organic resins. X-40-9225 can also be used as part of a room temperature coating for automotive applications and floors.
- High degree of polymerization. X-40-9225 has one of the highest molecular weights of the resin-like silicone oligomers
- Can be used a component of a 2 part room temperature coating. For more information, please see our silicone resins and oligomers brochure.
- Low volatile content
- Organic resin modifier. Can be used to improve water resistance and weatherability of many organic resins.
- Organic resin modification, 2-part room temperature coatings for automotive and floor applications.
Product type (taxonomy term)
Resins and Oligomers
Kinetic Viscosity @ 25°C (cSt)
Specific Gravity @ 25°C
Note: Values are not for specification purposes.
Warranty- The information and data contained herein are believed to be accurate and reliable; however it is the user's responsibility to determine suitability of use.
Since Shin-Etsu Silicones, Inc. cannot know all of the uses to which its products may be put or the conditions of use, it makes no warranties concerning the fitness or suitability of its products for a particular use or purpose. You should thoroughly test any proposed use of our products and independently conclude satisfactory performance in your application. Likewise, if the manner in which our products are used requires governmental approval or clearance, you must obtain it. Shin-Etsu Silicones, Inc. warrants only that its products will meet its specifications. There is no warranty of merchantability of fitness of use, nor any other expressed or implied warranties. The user's exclusive remedy and Shin-Etsu Silicones, Inc.'s sole liability is limited to refund of the price or replacement of any product shown to be otherwise than as warranted. Shin-Etsu Silicones, Inc. will not be liable for incidental or consequential damages of any kind. Suggestions of uses should not be taken as inducements to infringe any patents.