Product Description

Shin-Etsu's KER-6020-F1 is a single component, heat cure LED die bond that will cure to form a tough, durable elastomer. KER-6020-F1 is formulated for the unique rigors of die bonding LED dies to their substrate, exhibits high reflectivity, and exhibits excellent, long-term adhesive performance.

Product Features

  • High flexibility and adhesive strength
  • High reflectivity
  • Single component
  • Heat cure

Typical Applications

  • Die bonding LED chips
  • Protecting sensors, IC chips, and bonding wires


Typical Properties

LED Die Bond
Cure Type
One/Two Component
Cold Storage
White Translucent
Density @ 23C (g/cm3)
Viscosity (Pa·s)
Cure Conditions
1hr @ 150C
Shore A Hardness
Tensile Strength (MPa)
% Elongation
Shear Strength (psi)
Volume Resistivity (TΩ·m)
Dielectric Strength (kV/mm)
Dielectric Constant
2.9 @ 50Hz
Dielectric Dissipation Factor
5.8 x 10-4 @ 50Hz
Coefficient of Linear Expansion α1 (ppm)
Usable Temperature Range (C)
-60 to +200

Note: Values are not for specification purposes.

Warranty- The information and data contained herein are believed to be accurate and reliable; however it is the user's responsibility to determine suitability of use. Since Shin-Etsu Silicones, Inc. cannot know all of the uses to which its products may be put or the conditions of use, it makes no warranties concerning the fitness or suitability of its products for a particular use or purpose. You should thoroughly test any proposed use of our products and independently conclude satisfactory performance in your application. Likewise, if the manner in which our products are used requires governmental approval or clearance, you must obtain it. Shin-Etsu Silicones, Inc. warrants only that its products will meet its specifications. There is no warranty of merchantability of fitness of use, nor any other expressed or implied warranties. The user's exclusive remedy and Shin-Etsu Silicones, Inc.'s sole liability is limited to refund of the price or replacement of any product shown to be otherwise than as warranted. Shin-Etsu Silicones, Inc. will not be liable for incidental or consequential damages of any kind. Suggestions of uses should not be taken as inducements to infringe any patents.

Contact Us
Shin-Etsu Silicones of America, Inc.
1150 Damar Drive
Akron, Ohio 44305-1201

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